MAGAZINE
March
2024 IEEE Electronic Components and Technology Conference to Spotlight Cutting-Edge Microelectronics Packaging Technologies
The world’s leading forum for unveiling, discussing and exhibiting the latest advancements in microelectronics packaging and component science and technology is the IEEE Electronic Components and Technology Conference (ECTC).
Women MAKE Awards Recognizes GlobalFoundries’ Jennifer Robbins and Katelyn Harrison for Manufacturing Excellence
Last week, the Manufacturing Institute (MI)—the workforce development and education affiliate of the National Association of Manufacturers—honored two outstanding women from GlobalFoundries at their annual Women MAKE Awards
TSMC Certifies Ansys Multiphysics Platforms
Ansys today announced the certification of its power integrity platforms for TSMC’s N2 technology full production release.
StratEdge Takes High-Frequency Packaging Technology to New Heights at Upcoming Events
StratEdge Corporation is set to showcase its latest packaging technology for high-frequency applications at several industry conferences in May.
Great Strides in the Development of High Refractive Index Polymers for Optoelectronics
Researchers report a novel family of low-cost, sustainable polymers that could be useful for modern displays, photodetectors, and lighting devices.
Nordson Electronics Solutions Receives EM China Innovation Award
Nordson Electronics Solutions received the conformal coating equipment award from EM Asia China for the new ASYMTEK Select Coat SL-1040 conformal coating system, at an award ceremony during Productronica China, held March 21 in the Shanghai New International Expo Centre, Shanghai, China.
AMD’s Dr. Lisa Su Named Chief Executive Magazine’s 2024 CEO of the Year
Chief Executive magazine today announced that Dr. Lisa Su, CEO of AMD, has been named 2024 Chief Executive of the Year by her peer CEOs.
Gstar Announces Groundbreaking of Silicon Wafer Factory Construction in Indonesia
Recently, Gstar held a groundbreaking ceremony for its silicon rod and silicon wafer factory, marking the beginning of the rapid construction phase.
Celestial AI Announces Appointment of Diane Bryant to Board of Directors
Celestial AI, creator of the Photonic Fabric optical interconnect technology platform, today announced the appointment of Diane Bryant to the Company’s Board of Directors effective April 11, 2024.
Guerrilla RF Completes Strategic Acquisition of GaN Device Portfolio from Gallium Semiconductor
Guerrilla RF, Inc. has finalized the acquisition of Gallium Semiconductor’s entire portfolio of GaN power amplifiers and front-end modules.
Design Strategies Toward Plasmon-Enhanced 2-Dimensional Material Photodetectors
A research group from Southeast University provided a detailed overview of plasmon-enhanced 2D material photodetectors, mainly focusing on the clarification of different hybridization modes between plasmonic nanostructures and 2D materials.
Revolutionizing Memory Technology: Multiferroic Nanodots for Low-Power Magnetic Storage
In a significant milestone for multiferroic memory devices, a team of researchers led by Professor Masaki Azuma and Assistant Professor Kei Shigematsu from Tokyo Institute of Technology in Japan has successfully developed nanodots with single ferroelectric and ferromagnetic domains.
IBM, Government of Canada, Government of Quebec Sign Agreements to Strengthen Canada’s Semiconductor Industry
The agreements reflect a combined investment valued at approximately $187M CAD.
Cadence and TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
Cadence Design Systems, Inc. and TSMC have extended their longstanding collaboration by announcing a broad range of innovative technology advancements to accelerate design, including developments ranging from 3D-IC and advanced process nodes to design IP and photonics.
SEMI Applauds U.S. CHIPS Act Award for Micron Technology
“SEMI commends the U.S. Department of Commerce for this key step to strengthen the domestic semiconductor supply chain,” said Joe Stockunas, President of SEMI Americas.
Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes
Synopsys, Inc. today announced broad EDA and IP collaborations with TSMC for advanced node designs and have been deployed across a range of AI, high-performance computing, and mobile designs.
EFC Awarded CGA Environmental Excellence Award
In significant recognition of its commitment to sustainable practices, EFC Gases & Advanced Materials was awarded the 2024 Compressed Gas Association (CGA) Environmental Excellence Award at its annual meeting.
Silex Announces the First Pure-Play MEMS 12-inch Wafer Fab
Silex today announces the first 12-inch wafer fab for pure-play MEMS manufacturing.
Omdia Forecasts Strong Recovery in Large-Area Display Market for 2024
Research from Omdia’s newly released Large Area Display Market Tracker 4Q23 has found shipments of large-area displays (all displays above 9 inches), including both LCD and OLED, are forecasted to increase by 7.4% year-over-year (YoY) in units and 11.1% YoY in area in 2024.
Micron Secures $6.1B in CHIPS Funding
The proposed CHIPS funding will underwrite Micron’s plans to build the largest leading-edge memory fabrication semiconductor facility in the U.S. in Clay, NY.
JCET Q1 2024 Revenue and Net Profit Achieve Double-digit Year-on-Year Growth
JCET Group, a global provider of integrated circuit (IC) back-end manufacturing and technology services, today announced its financial results for the first quarter of 2024.
Opening Up the Potential of Thin-Film Electronics for Flexible Chip Design
New research demonstrates feasibility of ‘foundry’ model for flexible electronics.
A Flexible Microdisplay Can Monitor Brain Activity in Real-Time During Brain Surgery
The device represents a huge leap ahead to visualize brain activity to guide neurosurgeons.
Featured Video
Is your semiconductor plant seeking methods to enhance sustainability in wafer manufacturing and water reclamation? The semiconductor sector faces two challenges: waste reduction and water usage. The use of on-line water analytics can assist in overseeing water quality in both wafer manufacturing and reclamation/reuse procedures. This video underscores the significance of monitoring the levels of conductivity, TOC, and microbes to identify impurities that may lead to rejected wafers. Monitoring these parameters also ensures the purity of water to improve wafer quality and yield. Furthermore, this video emphasizes the importance of monitoring the levels of dissolved oxygen, TOC, and pH in waste streams to optimize water recovery.
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